Product Index

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Manufacturer

  • Maxim Integrated
  • Microchip Technology
  • onsemi
  • Texas Instruments

Series

  • *
  • -
  • 100EL
  • 54ABT
  • 54F
  • 74GTLP
  • 74LVTH
  • 74SSTV
  • ATE

Package

  • Bulk
  • Tape & Reel (TR)
  • Tray
  • Tube

Product Status

  • Active
  • Discontinued at
  • Obsolete

Logic Type

  • -
  • ABT Scan Test Device With Transceivers and Registers
  • ABT Scan Test Device With Universal Bus Transceivers
  • Binary Full Adder with Fast Carry
  • Comparator, Driver
  • Differential Receiver
  • LVTTL-TO-GTLP Adjustable-Edge-Rate Registered Transceiver
  • Registered Buffer with SSTL_2 Compatible I/O for DDR
  • Scan Test Device with Registered Bus Transceiver
  • Shift Register/Latches
  • Voltage Clamp

Supply Voltage

  • -
  • -1.5V ~ 6.5V
  • -1V ~ 5.2V
  • -2.2V ~ 5.2V
  • -2.2V ~ 6.2V
  • -4.5V ~ -5.25V, 9.5V ~ 10.5V
  • -4.5V ~ -6.5V, 9.5V ~ 10.5V
  • 2.3V ~ 2.7V
  • 2.7V ~ 3.6V
  • 3.15V ~ 3.45V
  • 3.3V, 5V
  • 4.5V ~ 5.5V

Number of Bits

  • -
  • 1
  • 18
  • 2
  • 22
  • 24, 48
  • 26
  • 32
  • 4
  • 8
  • 9

Operating Temperature

  • -
  • -40°C ~ 85°C
  • -40°C ~ 85°C (TA)
  • -55°C ~ 125°C
  • -55°C ~ 125°C (TA)
  • 0°C ~ 70°C

Mounting Type

  • -
  • Surface Mount
  • Through Hole

Package / Case

  • -
  • 100-TQFP Exposed Pad
  • 114-LFBGA
  • 16-CDIP (0.300", 7.62mm)
  • 16-CFlatPack
  • 20-CLCC
  • 44-WFQFN Exposed Pad
  • 48-TFSOP (0.173", 4.40mm Width)
  • 48-TFSOP (0.240", 6.10mm Width)
  • 64-LQFP
  • 64-TFSOP (0.240", 6.10mm Width)
  • 64-TQFP Exposed Pad
  • 68-CFlatPack
  • 8-SOIC (0.154", 3.90mm Width)
  • 80-TQFP Exposed Pad
  • 96-LFBGA

Supplier Device Package

  • -
  • 100-TQFP-EP (14x14)
  • 100-TQFP-EPR (14x14)
  • 114-BGA MICROSTAR (16x5.5)
  • 16-CDIP
  • 16-CFP
  • 20-LCCC (8.89x8.89)
  • 44-WQFN (7x7)
  • 48-TSSOP
  • 48-TVSOP
  • 64-LQFP (10x10)
  • 64-TQFP-EP (10x10)
  • 64-TSSOP
  • 68-CQFP (12.7x12.7)
  • 8-SOIC
  • 80-TQFP-EP (12x12)
  • 96-LFBGA (13.5x5.5)

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Products - Record(s)

Bushings, Grommets

Bushinas and Grommets are used to insulate between an opening in a panel and anycharacteristics are bushing/grommet type, panel thickness, panel cutout dimensions,diameterinside and materie<br />(most often cables and wire) that are inserted into the opening. These devices can also hold the inserted objects securely between the two sides of the opening. The