Product Index
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Results: 0
Manufacturer
- Analog Devices Inc.
- Analog Devices Inc./Maxim Integrated
- Fairchild Semiconductor
- Microchip Technology
- Murata Electronics
- NXP USA Inc.
- onsemi
- STMicroelectronics
- TDK InvenSense
Model Series
- *
- -
- Automotive, AEC-Q100
- FireFly
- FMT1000
- iMEMS®
- iMEMS®, iSensor™
- iNEMO
- iSensor®
- MotionTracking™
- SCH16T
- SmartMotion™
Package
- Bag
- Box
- Bulk
- Strip
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Not For New Designs
- Obsolete
Sensor Type
- -
- Accelerometer, Barometric Pressure, Gyroscope, Magnetometer, 9 Axis
- Accelerometer, Gyroscope, 6 Axis
- Accelerometer, Gyroscope, Magnetometer, 9 Axis
- Accelerometer, Gyroscope, Magnetometer, Temperature, 9 Axis
- Accelerometer, Gyroscope, Temperature, 6 Axis
- Accelerometer, Magnetometer, 6 Axis
- Accelerometer, Magnetometer, Temperature, 6 Axis
Output Type
- -
- CAN, I²C, SPI, USART
- I2C
- I2C, I3C, SPI
- I2C, SPI
- I²C
- I²C, I3C℠, SPI
- I²C, MIPI I3C, SPI
- I²C, SPI
- I²C, SPI, UART
- SPI
- SPI, UART
Operating Temperature
- -
- -25°C ~ 85°C
- -25°C ~ 85°C (TA)
- -30°C ~ 85°C (TA)
- -40°C ~ 105°C
- -40°C ~ 105°C (TA)
- -40°C ~ 110°C
- -40°C ~ 125°C
- -40°C ~ 85°C
- -40°C ~ 85°C (TA)
- 0°C ~ 70°C
Package / Case
- -
- 100-BBGA Module
- 12-VFLGA Module
- 14-VFLGA
- 14-VFLGA Module
- 14-WFLGA
- 16-LFQFN Module
- 16-LQFN Exposed Pad
- 16-SMD Module
- 16-VFLGA Exposed Pad
- 16-VFLGA Module
- 16-VFLGA Module Exposed Pad
- 16-WFLGA Module
- 24-BSOP (0.370", 9.40mm Width)
- 24-LFLGA Module
- 24-SMD Module
- 24-TFLGA Module
- 24-TFQFN Exposed Pad
- 24-TFQFN Module Exposed Pad
- 24-VFLGA
- 24-VFQFN Module Exposed Pad
- 28-LCC Module
- 28-TFLGA Module
- 28-VFLGA Module
- 32-BSOP (0.335", 8.50mm Width)
- 32-TFLGA
- 44-BBGA Module
- Module
Supplier Device Package
- -
- 100-BGA Module (15x15)
- 12-LGA (2x2)
- 14-LGA (2.5x3)
- 14-LGA (3x5)
- 16-HLQFNR (4x4)
- 16-LGA (3.3x3.3)
- 16-LGA (3x3)
- 16-QFN (3x3)
- 24-DQFN (4.5x4.5)
- 24-LGA (3x3)
- 24-LGA (3x3.5)
- 24-LGA (4x4)
- 24-QFN (3x3)
- 24-QFN (4x4)
- 24-SOIC
- 28-LGA (3x5.5)
- 28-LGA (4x5)
- 28-LGA (5x5)
- 28-LGA (7.5x4.4)
- 28-PLCC (12.1x12.1)
- 32-LGA (4x4)
- 32-SOIC
- 44-BGA Module
- Module
Mounting Type
- -
- Chassis Mount
- Surface Mount
- Surface Mount, Wettable Flank
Media
Stocking Options
Products - Record(s)
Bushings, Grommets
Bushinas and Grommets are used to insulate between an opening in a panel and anycharacteristics are bushing/grommet type, panel thickness, panel cutout dimensions,diameterinside and materie<br />(most often cables and wire) that are inserted into the opening. These devices can also hold the inserted objects securely between the two sides of the opening. The