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Manufacturer

  • Analog Devices Inc.
  • Texas Instruments

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Package

  • Box
  • Bulk

Part Status

  • Active

Prototype Board Type

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  • Plated Through Hole to Plated Through Hole
  • SMD to DIP
  • SMD to Plated Through Hole
  • SMD to SMD

Package Accepted

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  • DFN, MSOP, SC70, SOIC, SOT-23
  • DPW-5, DCN-8, DDF-8, DSG-8, RUG-10, RUC-14, RGY-14, RTE-16
  • MSOP, SC70, SOIC, SOT23, SOT563, TSSOP
  • QFN
  • SC-70, SOT-23, SOT-583, SSOP, VSSOP
  • SOIC, TSSOP

Number of Positions

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  • 16
  • 6
  • 8

Pitch

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PCB Thickness

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  • 0.063" (1.60mm)

Material

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  • FR4 Epoxy Glass

Size / Dimension

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Products - Record(s)

Bushings, Grommets

Bushinas and Grommets are used to insulate between an opening in a panel and anycharacteristics are bushing/grommet type, panel thickness, panel cutout dimensions,diameterinside and materie<br />(most often cables and wire) that are inserted into the opening. These devices can also hold the inserted objects securely between the two sides of the opening. The