Product Index

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Manufacturer

  • Analog Devices Inc.
  • Maxim Integrated
  • Microchip Technology
  • onsemi
  • STMicroelectronics
  • Texas Instruments

Series

  • *
  • -
  • Automotive, AEC-Q101
  • ECOPACK®
  • FBSH
  • FPS™

Package

  • Bulk
  • Cut Tape (CT)
  • Strip
  • Tape & Reel (TR)
  • Tray
  • Tube

Product Status

  • Active
  • Discontinued at
  • Not For New Designs
  • Obsolete

Output Isolation

  • -
  • Either
  • Isolated
  • Non-Isolated

Internal Switch(s)

  • -
  • No
  • Yes

Voltage - Breakdown

  • -
  • 600V
  • 650V
  • 670V
  • 700V
  • 800V

Topology

  • -
  • Boost, Buck, Flyback, Forward
  • Boost, Flyback
  • Boost, Flyback, SEPIC
  • Flyback
  • Flyback, Forward
  • Flyback, Secondary Side SR
  • Forward
  • Full-Bridge
  • Half-Bridge

Voltage - Start Up

  • -
  • 10 V
  • 10.5 V
  • 11.9 V
  • 12 V
  • 14.5 V
  • 15 V
  • 15.3 V
  • 16 V
  • 18 V
  • 2.5 V
  • 20 V
  • 22 V
  • 23.6 V
  • 5.4 V
  • 8.1 V

Voltage - Supply (Vcc/Vdd)

  • -
  • 10.8V
  • 10.8V ~ 24V
  • 10V
  • 10V ~ 26V
  • 11.3V ~ 25V
  • 2.4V ~ 27V
  • 20V ~ 26V
  • 4.2V ~ 60V
  • 4.5V ~ 29V
  • 4.5V ~ 36V
  • 5V ~ 23V
  • 6.6V ~ 28V
  • 7V ~ 26V
  • 7V ~ 30V
  • 8.8V ~ 35V
  • 8V ~ 29V
  • 8V ~ 30V
  • 9.5V ~ 20V
  • 9.5V ~ 24V
  • 9.5V ~ 28V
  • 9V ~ 20V
  • 9V ~ 23V
  • 9V ~ 35V

Duty Cycle

  • -
  • 48%
  • 50%
  • 55%
  • 63%
  • 68%
  • 69%
  • 72.5%
  • 75%
  • 80%
  • 82.5%
  • 85%
  • 92%
  • 94.5%
  • 96%

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Products - Record(s)

Bushings, Grommets

Bushinas and Grommets are used to insulate between an opening in a panel and anycharacteristics are bushing/grommet type, panel thickness, panel cutout dimensions,diameterinside and materie<br />(most often cables and wire) that are inserted into the opening. These devices can also hold the inserted objects securely between the two sides of the opening. The